Power amplifying module

Details Power amplifying module Power amplifying module

1996-06-21

1998-05-19

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257711, 257713, 361715, 361719, 361761, H05K 720

Patent

active

057544026

ABSTRACT:
A power amplifying module has at least one heat spreader mounted on a package substrate and exposed through a through hole provided in a wiring substrate, and at least one semiconductor chip forming a power amplifying circuit is mounted in a bare chip state on a surface of the at least one heat spreader as electrically connected to an electronic circuit pattern on the wiring substrate. Each of the package substrate and at least one heat spreader is made of a material having a thermal conductivity larger than that of a material making the wiring substrate. The module thus formed can emit the heat generated by the power amplifying module to the outside at high efficiency, thus achieving the power amplifying module with high performance and high reliability.

REFERENCES:
patent: 4135168 (1979-01-01), Wade
patent: 4227036 (1980-10-01), Fitzgerald
patent: 5398160 (1995-03-01), Umeda

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