Power amplifying module

Details Power amplifying module Power amplifying module

1996-06-21

1998-11-10

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 802, 165185, 174 163, 257707, 257713, 361715, 361717, H05K 720

Patent

active

058353526

ABSTRACT:
A power amplifying module has a package formed by welding a package bottom plate being a package substrate of a generally flat plate shape with a cap being a metal package cap of a generally rectangular box shape. A wiring substrate of a generally flat plate shape is placed on the package bottom plate and this wiring substrate is covered by the cap. There are two through holes formed in the wiring substrate and two heat spreaders of a generally flat plate shape are positioned in portions exposed through the through holes on the package bottom plate. Semiconductor devices sealed with a resin or the like are set by soldering or the like on respective surfaces of these heat spreaders.

REFERENCES:
patent: 4135168 (1979-01-01), Wade
patent: 4227036 (1980-10-01), Fitzgerald
patent: 5041943 (1991-08-01), Ilardi et al.
patent: 5311402 (1994-05-01), Kobayashi et al.
patent: 5398160 (1995-03-01), Umeda

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