Power amplifier module assembly

Details Power amplifier module assembly Power amplifier module assembly

2005-09-27

2005-09-27

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S704000, C361S718000, C361S720000, C257S718000, C257S719000, C165S080300, C165S185000

Reexamination Certificate

active

06950309

ABSTRACT:
A power amplifier module assembly (100) includes a PA module (102) having a flange (104) and a mounting bracket (106) coupled thereto. A thermally conductive pad (108) having an electrically conductive surface (110) that couples to the mounting bracket (106) and the flange (104) via a chassis (204) so as to provide both shielding and thermal dissipation to the PA module (102).

REFERENCES:
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patent: 5428504 (1995-06-01), Bhatla
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patent: 5546275 (1996-08-01), Moutrie et al.
patent: 5610799 (1997-03-01), Kato
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patent: 5831826 (1998-11-01), Van Ryswyk
patent: 6636429 (2003-10-01), Maly et al.
patent: 6771507 (2004-08-01), Belady et al.
The Bergquist Company, “Thermal Materials: Sil-Pad Products” 2003, http://www.bergquistcompany.com/tm—sil—pad—detail.cfm?oid =104265.

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