Power amplifier assembly

Details Power amplifier assembly Power amplifier assembly

1993-08-12

1994-10-04

Sikes, William L.

Amplifiers

With semiconductor amplifying device

Including temperature compensation means

330 65, 330 66, 330 67, 330 68, 257706, 257707, H01L 2336, H01L 2334

Patent

active

053529910

ABSTRACT:
A power amplifier assembly that dissipates a maximum of one thousand one hundred watts includes a power amplifier circuit and a chassis that has an overall volume of 0.02 cubic meters. The chassis includes a heat sink base that contains a mounting pattern for the power amplifier circuit. By thermally coupling the power amplifier circuit to the heat sink base via thermal coupling devices and the mounting pattern, the heat sink base dissipates a maximum of one thousand one hundred watts in a volume of 0.016 cubic meters.

REFERENCES:
patent: 3824597 (1974-07-01), Berg
patent: 4688002 (1987-08-01), Wingate
patent: 4703339 (1987-10-01), Matsuo
patent: 4963833 (1990-10-01), Mountz
patent: 5168926 (1992-12-01), Watson et al.
patent: 5184211 (1993-02-01), Fox

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