Powder mixtures for metallization of substrate surfaces

Details Powder mixtures for metallization of substrate surfaces Powder mixtures for metallization of substrate surfaces

1994-06-08

1996-01-30

Goodrow, John

Radiation imagery chemistry: process, composition, or product th

Imaged product

Deposited metal coating on image

106 111, 427304, 4274431, C23C 1830

Patent

active

054879647

ABSTRACT:
New spray powder formulations are described which, after application in the form of a thin layer to substrate surfaces with the aid of processes basset on electrostatic attraction and storing of this layer by heat or high-energy radiation, allow the deposition of firmly adhering layers of metal by currentless, wet-chemical metallization. The essential constituents of such a formulation are a pulverulent, non-conductive material and (semi-) noble metal compounds.

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Specification of U.S. Ser. No. 788,957, filed on Nov. 7, 1991, for "Primer for the Metallisation of Substrate Surfaces", pp. 1-21+abstract page.

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