Powder metal heat sink for integrated circuit devices

Specialized metallurgical processes – compositions for use therei – Compositions – Consolidated metal powder compositions

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75247, 75249, H01L 2334

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active

058697780

ABSTRACT:
Apparatus for use in cooling an integrated circuit structure. The apparatus includes a heat sink having a first portion configured for thermal engagement with an integrated circuit device and a second portion configured for the dissipation of heat into an ambient fluid, such as air. The heat sink is made from a powdered metal which, in one preferred embodiment, includes copper. The heat sink may be formed from the plurality of discrete layers, each layer having a button projecting from one surface, and a depression formed in an opposing surface. The depression is configured to receive a projecting button portion from another layer. In an alternative embodiment the heat sink includes a plurality of plugs projecting from the generally flat surface.

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"Powder Metallurgy Division" (a booklet) by St. Mary's Carbon Company, 28 pages.
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