Powder metal heat sink for integrated circuit devices

Details Powder metal heat sink for integrated circuit devices Powder metal heat sink for integrated circuit devices

1993-12-14

1996-05-07

Walsh, Donald P.

Powder metallurgy processes

Powder metallurgy processes with heating or sintering

Powder pretreatment

419 38, 419 39, 419 65, 419 66, B22F 316

Patent

active

055143270

ABSTRACT:
Apparatus for use in cooling an integrated circuit structure. The apparatus includes a heat sink having a first portion configured for thermal engagement with an integrated circuit device and a second portion configured for the dissipation of heat into an ambient fluid, such as air. The heat sink is made from a powdered metal which, in one preferred embodiment, includes copper. The heat sink may be formed from the plurality of discrete layers, each layer having a button projecting from one surface, and a depression formed in an opposing surface. The depression is configured to receive a projecting button portion from another layer. In an alternative embodiment the heat sink includes a plurality of plugs projecting from the generally flat surface.

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