Powder for use in dry sensitization for electroless plating

Details Powder for use in dry sensitization for electroless plating Powder for use in dry sensitization for electroless plating

1982-07-22

1985-01-22

Lilling, Herbert J.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

106 111, 427 47, 427195, 427212, 427304, 427305, 427306, 428407, 523204, 524310, 524317, 524434, B05D 300, C08K 310, C23C 302

Patent

active

044952163

ABSTRACT:
A powdered composition for use in dry sensitization for electroless metal deposition. The composition contains a hydrophobic thermoplastic material having deposited on its surface a surfactant and a sensitizing tin compound.

REFERENCES:
patent: 3917555 (1975-11-01), Worschech et al.
patent: 3983263 (1976-09-01), Weiss et al.
patent: 4020009 (1977-04-01), Gulla
patent: 4042730 (1977-08-01), Cohen et al.
patent: 4053659 (1977-11-01), Gebauer et al.
patent: 4115334 (1978-09-01), Gerow
patent: 4116924 (1978-09-01), Peabody
patent: 4181759 (1980-01-01), Feldstein
patent: 4220678 (1980-09-01), Feldstein
patent: 4287253 (1981-09-01), Leech
Derwent Abs., 96168 D/52, (11-1981).

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