Metal working – Barrier layer or semiconductor device making – Barrier layer device making
Reexamination Certificate
2007-02-26
2009-08-04
Trinh, Minh (Department: 3729)
Metal working
Barrier layer or semiconductor device making
Barrier layer device making
C029S025420, C029S729000, C361S523000, C361S525000, C264S219000
Reexamination Certificate
active
07569080
ABSTRACT:
A powder compaction process using opposed rib and channel punches which are interleaved and a production method are used to produce capacitor elements having a uniform compaction density and which are free of surface imperfections.
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Hardaway, III John B.
Kemet Electonics Corporation
Nexsen Pruet , LLC
Trinh Minh
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