Potting and encapsulating material for electronic circuits

Details Potting and encapsulating material for electronic circuits Potting and encapsulating material for electronic circuits

1979-10-16

1980-11-04

Jacobs, Lewis T.

Chemistry of carbon compounds

Miscellaneous organic carbon compounds

260 40R, C08L 6302

Patent

active

042319161

ABSTRACT:
A homogeneous mixture of uncured thermosetting resin and curing agent in a flowable powder form with a particle size in the range of approximately 60 mesh to 200 mesh and curable in a range of approximately 125.degree. F. to 212.degree. F., and hollow microspheres having a diameter in the range of approximately 5 microns to 300 microns, with the resin-curing agent and microspheres being intermixed in a ratio in the range of approximately 35 percent to 45 percent resin-curing agent to microspheres by weight.

REFERENCES:
patent: 3533985 (1970-10-01), Lantz et al.
patent: 3536656 (1970-10-01), Sommer
patent: 3652486 (1972-03-01), Young
patent: 3864426 (1975-02-01), Salensky

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