Post-press heat treatment process for improving the dimensional

Plastic and nonmetallic article shaping or treating: processes – Forming articles by uniting randomly associated particles – Utilizing diverse solid particles

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264109, B29C 4352

Patent

active

050493345

ABSTRACT:
There is provided a process for improving the thickness swelling properties of a manufactured waferboard panel. The process is based on the discovery that a correlative relationship exists between the relative thickness swelling properties versus the parametric properties of time and temperature. Thus the process involves subjecting the manufactured board to a post-heat treatment at a predetermined temperature for a predetermined time in order to obtain the desired percentage reduction in thickness swelling.

REFERENCES:
patent: 3969460 (1976-07-01), Fremont et al.
patent: 4393019 (1983-07-01), Geimer

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