Post-polishing semiconductor surface cleaning process

Cleaning and liquid contact with solids – Processes – For metallic – siliceous – or calcareous basework – including...

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51323, 134 28, 134 29, B08B 308

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active

041167147

ABSTRACT:
Semiconductor materials are cleaned after silica polishing by treatment with an aqueous phosphoric acid containing solution followed by rinsing in water. The treatment dissolves the silica sols so that they are removed from the semiconductor surface.

REFERENCES:
patent: 2744000 (1956-05-01), Seiler
patent: 3715249 (1973-02-01), Panousis et al.
patent: 3728154 (1973-04-01), Suzuki
patent: 3871931 (1975-03-01), Godber
J. Electrochem. Soc., Meek et al., "Silicon Surface Contamination: Polishing and Cleaning", vol. 120, No. 9, Sep. 1973, pp. 1241-1242.

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