Post-polishing semiconductor surface cleaning process

Details Post-polishing semiconductor surface cleaning process Post-polishing semiconductor surface cleaning process

1977-08-15

1978-09-26

Bashore, S. Leon

Cleaning and liquid contact with solids

Processes

For metallic, siliceous, or calcareous basework, including...

51323, 134 28, 134 29, B08B 308

Patent

active

041167147

ABSTRACT:
Semiconductor materials are cleaned after silica polishing by treatment with an aqueous phosphoric acid containing solution followed by rinsing in water. The treatment dissolves the silica sols so that they are removed from the semiconductor surface.

REFERENCES:
patent: 2744000 (1956-05-01), Seiler
patent: 3715249 (1973-02-01), Panousis et al.
patent: 3728154 (1973-04-01), Suzuki
patent: 3871931 (1975-03-01), Godber
J. Electrochem. Soc., Meek et al., "Silicon Surface Contamination: Polishing and Cleaning", vol. 120, No. 9, Sep. 1973, pp. 1241-1242.

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