Post-polish cleaning of oxidized substrates by reverse colloidat

Details Post-polish cleaning of oxidized substrates by reverse colloidat Post-polish cleaning of oxidized substrates by reverse colloidat

1990-08-14

1992-01-07

Pal, Asok

Cleaning and liquid contact with solids

Processes

Using sequentially applied treating agents

15 971, 511311, 511313, 511314, 134 7, 148DIG17, 437974, 437946, 437225, B08B 600

Patent

active

050788019

ABSTRACT:
A method for cleaning the surface of an oxidized semiconductor wafer subjected to a planarization polishing process is described. The planarization process employes a slurry which contains abrasive particles suspended in a liquid solution. The invented cleaning method removes remnant particles electrochemically by placing the polished wafers in a PH-controlled bath.

REFERENCES:
patent: 3683562 (1972-08-01), Day
patent: 3841031 (1974-10-01), Walsh
patent: 3857123 (1974-12-01), Walsh
patent: 3998653 (1976-12-01), Anthony et al.
patent: 4879258 (1989-11-01), Fisher
patent: 4968381 (1990-11-01), Prigge et al.

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