Post last wiring level inductor using patterned plate process

Details Post last wiring level inductor using patterned plate process Post last wiring level inductor using patterned plate process

2008-07-16

2010-06-22

Trinh, Michael (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Integrated circuit structure with electrically isolated...

Passive components in ics

C257S532000, C257SE21022

Reexamination Certificate

active

07741698

ABSTRACT:
A semiconductor structure. The semiconductor structure includes: a substrate having a metal wiring level within the substrate; a capping layer on and above a top surface of the substrate; an insulative layer on and above a top surface of the capping layer; an inductor comprising a first portion in and above the insulative layer and a second portion only above the insulative layer; and a wire bond pad within the insulative layer, wherein the first portion the inductor has a height in a first direction greater than a height of the wire bond pad in the first direction, wherein the first direction is perpendicularly directed from the top surface of substrate toward the insulative layer.

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