Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1996-11-20
1998-06-23
Mayes, Curtis
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156267, 1563066, B32B 3126
Patent
active
057699879
ABSTRACT:
We disclose a fabrication method for integrating passive devices such as capacitors, resistors and circulators into ceramic packages for electronic systems. The method utilizes a glass or glass/ceramic as a bonding agent which is incorporated as one of the layers in the multilayer package. The integration of such passive devices eliminates the tedious mounting of these devices on the package, permitting a smaller, more reliable, less expensive and lighter weight product. This method allows the integration of passive devices having firing temperatures far different from that of the ceramic package itself, permitting combinations of materials that cannot be densified, or cofired together.
REFERENCES:
patent: 4459166 (1984-07-01), Dietz et al.
patent: 4592794 (1986-06-01), Davis et al.
patent: 5076876 (1991-12-01), Dietz
patent: 5601673 (1997-02-01), Alexander
"Monolithic Multicomponents Ceramic (MMC) Substrate" by Kazuaki Utsumi et al., Ferroelectrics, 1986, vol. 68, pp. 157-179.
"Multilayer Ceramic Substrate with Inner Capacitors" by Yoshihiro Fujioka et al., IMC 1992 Proceedings, Yokohama, Jun. 3-5, 1992, pp. 355-359.
Bailey Alex E.
Gurkovich Stephen R.
Partlow Deborah P.
Piloto Andrew J.
Radford Kenneth C.
Mayes Curtis
Northrop Grumman Cropration
Sutcliff Walter G.
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