Post fabrication processing of semiconductor chips

Details Post fabrication processing of semiconductor chips Post fabrication processing of semiconductor chips

1990-07-02

1992-07-14

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437183, 437190, 437192, 437246, 2281802, H01L 21302

Patent

active

051302756

ABSTRACT:
A method for processing semiconductor chips which deters the formation of "tin whiskers" and which removes excess substrate material from the passive side of a semiconductor device is presented. The deterrence of tin whiskers is accomplished by controlling the size of the bead of flowable metal on the conductive bump. The removal of excess material from the passive side of the semiconductor device is accomplished by chemical reaction after the formation of the conductive bump.

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U. Lindborg, "A Model for the Spontaneous Growth of Zinc, Cadmium, and Tin Whiskers" ACTA Metallurgica, vol. 24, pp. 181-186, Pergamon Press 1976.

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