Cleaning and liquid contact with solids – Processes – For metallic – siliceous – or calcareous basework – including...
Patent
1993-07-13
1995-05-02
Kastler, Scott
Cleaning and liquid contact with solids
Processes
For metallic, siliceous, or calcareous basework, including...
134 38, 134 40, B08B 308
Patent
active
054115957
ABSTRACT:
A novel, environmentally innocuous, post-etch, pre-soldering cleaner and cleaning process is disclosed for removing contaminants from plated surfaces of printed circuit boards manufactured by the pattern plating method. The post-etch, cleaning process of this invention, for removing contaminants from plated surfaces of an etched printed circuit, comprises treating the plated surfaces with a cleaning solution which comprises an aqueous solution of (i) an imidazole-2-thione compound and (ii) an acid. The imidazole-2-thione compound has the formula: ##STR1## wherein A and B are the same or different --R--Y groups, wherein R is a linear, branched or cyclic alkenyl group containing 1 to 12 carbon atoms and Y is a hydrogen, halogen, cyano, vinyl, phenyl or ether moiety. Of this class of compounds, 1-methyl-3-propylimidazole-2-thione is preferred. The novel aqueous cleaners of this invention are effective replacements for conventional cleaners containing the toxic material thiourea and are superior to cleaners free of thiourea.
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Printed Circuits Handbook, Third Edition, edited by Clyde F. Coombs, Jr., McGraw-Hill, Dec. 1988; pp. 11.21-11.24, 14.4-14.5; 23.13 and 23.16-23.17.
Bokisa, Sr. George S.
Loar Gary W.
Vitale Americus C.
Hauser William P.
Kastler Scott
McGean-Rohco, Inc.
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