Post-CMP wafer clean process

Details Post-CMP wafer clean process Post-CMP wafer clean process

1998-11-19

2000-02-15

Gulakowski, Randy

Cleaning and liquid contact with solids

Processes

Including application of electrical radiant or wave energy...

510175, 510176, B08B 600, C11D 904

Patent

active

060241063

ABSTRACT:
A post-CMP wafer clean process. A post-CMP wafer is provided. A portion of particles and slurry are removed from the wafer by double side scrubber. The residual particles and slurry are then removed from the wafer in a solvent tank by magasonic and a solvent in the solvent tank includes an amine-based compound.

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