Cleaning compositions for solid surfaces – auxiliary compositions – Cleaning compositions or processes of preparing – For cleaning a specific substrate or removing a specific...
Reexamination Certificate
2011-04-05
2011-04-05
Boyer, Charles I (Department: 1761)
Cleaning compositions for solid surfaces, auxiliary compositions
Cleaning compositions or processes of preparing
For cleaning a specific substrate or removing a specific...
C510S176000, C510S432000, C510S504000, C134S001300, C134S022130, C134S022140
Reexamination Certificate
active
07919446
ABSTRACT:
Compositions comprise a purine compound; an alcohol amine; a quaternary ammonium salt; an amino acid, and optionally an antioxidant. The compositions are useful in post-CMP cleaning processes. One particular advantage of these compositions is that they can effectively remove slurry contamination without increasing the roughness of the copper surface.
REFERENCES:
patent: 2003/0083214 (2003-05-01), Kakizawa et al.
patent: 2008/0004197 (2008-01-01), Kneer
patent: 2009/0239777 (2009-09-01), Angst et al.
Duong Anh
Fresco Zachary M.
Gorer Alexander
Kalyankar Nikhil
Lang Chi-I
Boyer Charles I
Intermolecular, Inc.
LandOfFree
Post-CMP cleaning compositions and methods of using same does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Post-CMP cleaning compositions and methods of using same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Post-CMP cleaning compositions and methods of using same will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2628082