Post-CMP cleaner apparatus and method

Details Post-CMP cleaner apparatus and method Post-CMP cleaner apparatus and method

1999-03-29

2000-02-22

Stinson, Frankie L.

Cleaning and liquid contact with solids

Apparatus

Sequential work treating receptacles or stations with means...

134902, 134153, B08B 304

Patent

active

060268301

ABSTRACT:
An improved and new apparatus and method for post chemical-mechanical planarization (CMP) cleaning has been developed. Use of a QDR (Quick Dump Rinse) DI water bath for receiving a cassette of semiconductor substrates from a previous CMP processing station, for keeping the semiconductor substrates submerged in DI water following CMP and before transmission to a next processing station and for performing at least one rinsing and dumping operation on the semiconductor substrates in flowing DI water greatly enhances the manufacturing throughput of the process, reduces the use of chemicals, and simplifies the tool requirements for the post-CMP cleaning process.

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