Positive working polyamic acid/imide photoresist compositions an

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357 54, 357 72, H01L 2934, H01L 2328

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active

051384248

ABSTRACT:
Positive working polyamic acid photoresist compositions are disclosed having improved high resolution upon image development and exhibiting stable photosensitivity and superior dielectric performance. The compositions comprise polyamic acid condensation products of an aromatic dianhydride and an aromatic di-primary amine wherein a percentage of the diamine comprises special dissolution inhibiting monomers. The compositions may be further improved by the presence of particular supplemental additives.

REFERENCES:
patent: 4827326 (1989-05-01), Altman et al.
patent: 4927736 (1990-05-01), Mueller et al.

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