Radiation imagery chemistry: process – composition – or product th – Diazo reproduction – process – composition – or product – Composition or product which contains radiation sensitive...
Patent
1997-09-11
1998-10-06
Chu, John S.
Radiation imagery chemistry: process, composition, or product th
Diazo reproduction, process, composition, or product
Composition or product which contains radiation sensitive...
430170, 4302701, 4302711, 430512, G03F 7004
Patent
active
058174443
ABSTRACT:
Proposed is a novel chemical-sensitization positive-working photoresist composition suitable for fine patterning of a resist layer in the manufacture of electronic devices. The composition is advantageous in various properties of photoresist composition without little dependency on the nature of the substrate surface, on which the photoresist layer is formed, with or without an antireflection undercoating layer. The most characteristic ingredient in the inventive composition is the film-forming resinous ingredient which is a combination of a first polyhydroxystyrene resin substituted by tetrahydropyranyl groups for the hydroxyl groups and a second hydroxystyrene resin substituted by alkoxyalkyl groups for the hydroxyl groups in a specified weight proportion of the first and second resins.
REFERENCES:
patent: 5069997 (1991-12-01), Schwalm et al.
patent: 5558971 (1996-09-01), Urano et al.
patent: 5585218 (1996-12-01), Nakano et al.
patent: 5736296 (1998-04-01), Sato et al.
patent: 5750309 (1998-05-01), Hatakeyama et al.
Nakayama Toshimasa
Nitta Kazuyuki
Sakai Yoshika
Sato Kazufumi
Yamazaki Akiyoshi
Chu John S.
Tokyo Ohka Kogyo Co. Ltd.
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