Positive-working photoresist composition

Radiation imagery chemistry: process – composition – or product th – Diazo reproduction – process – composition – or product – Composition or product which contains radiation sensitive...

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430191, 430193, 430326, 430331, 534556, 534557, G03C 154, G03C 160

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active

048943118

ABSTRACT:
A positive-working photoresist composition containing an alkali-soluble novolak resin and a photosensitive compound represented by the formula ##STR1## wherein D.sub.1 and D.sub.2, which may be the same or different, each represents a 1,2-naphthoquinonediazido-5-sulfonyl group or a 1,2-naphthoquinonediazido-4-sulfonyl group; R.sub.1 and R.sub.2, which may be the same or different, each represents an alkoxy group, or an alkyl ester group; and a, b, c, and d each is 0 or an integer from 1 to 5, provided that (a+b).gtoreq.1 and (c+d).gtoreq.1.
The photoresist composition is excellent in sensitivity and resolving power and forms a resist pattern having good sectional shape and high heat resistance on, for example, a semiconductor. The photoresist composition is also applicable for forming a resist pattern having a line width of less than 1 .mu.m.

REFERENCES:
patent: 3046118 (1962-07-01), Schmidt
patent: 3106465 (1963-10-01), Naugebauer et al.
patent: 3148983 (1964-09-01), Endermann et al.
patent: 3802885 (1974-04-01), Lawson et al.
patent: 4499171 (1985-02-01), Hosaka et al.
patent: 4725523 (1988-02-01), Miura et al.
patent: 4738915 (1988-04-01), Komine et al.
English Translation of Japanese Publication No. 60-121445, published, 6/28/85 (Hosaka et al.)

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