Positive-type photosensitive resin composition

Details Positive-type photosensitive resin composition Positive-type photosensitive resin composition

2005-08-16

2005-08-16

Chu, John S. (Department: 1752)

Radiation imagery chemistry: process, composition, or product th

Radiation modifying product or process of making

Screen other than for cathode-ray tube

C430S191000, C430S192000, C430S193000, C430S326000

Reexamination Certificate

active

06929890

ABSTRACT:
Disclosed is a positive-type photosensitive resin composition comprising: (a) an alkali-soluble resin; (b) a quinone diazide compound; (c) a heatsensitive compound which colors upon being heated and which shows an absorption maximum at a wavelength of not less than 350 nm and not more than 700 nm; and (d) a compound which does not have an absorption maximum at a wavelength of not less than 350 nm to less than 500 nm, and has an absorption maximum at a wavelength of not less than 500 nm and not more than 750 nm. The composition is preferably used for forming light-blocking separators or black matrices of organic electroluminescent devices and liquid crystal display elements.

REFERENCES:
patent: 5780201 (1998-07-01), Sabnis et al.
patent: 6696112 (2004-02-01), Okuda et al.
patent: 1 037 112 (2000-09-01), None
patent: 1 296 540 (2003-03-01), None
European Search Report dated Sep. 28, 2004, issued in counterpart EP Application No. 04252045.

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