Positive resist composition of chemical amplification type,...

Radiation imagery chemistry: process – composition – or product th – Diazo reproduction – process – composition – or product – Composition or product which contains radiation sensitive...

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C430S270100, C430S313000, C430S317000, C430S324000, C430S905000, C438S778000, C438S780000, C438S781000, C438S782000

Reexamination Certificate

active

06921621

ABSTRACT:
The present invention provides a resist composition comprising (A) polyhydroxystyrene in which at least a portion of hydrogen atoms of hydroxyl groups are substituted with an acid-dissociable dissolution inhibiting group, and the solubility in an alkali solution of the polyhydroxystyrene increasing when the acid-dissociable dissolution inhibiting group is eliminated by an action of an acid, and (B) a component capable of generating an acid by irradiation with radiation, wherein a retention rate of the acid-dissociable dissolution inhibiting group of the component (A) after a dissociation test using hydrochloric acid is 40% or less, and also provides a chemical amplification type positive resist composition which contains polyhydroxystyrene in which at least a portion of hydrogen atoms of hydroxyl groups are substituted with a lower alkoxy-alkyl group having a straight-chain or branched alkoxy group, and the solubility in an alkali solution of the polyhydroxystyrene increasing when the lower alkoxy-alkyl group is eliminated by an action of an acid, in place of the component (A).

REFERENCES:
patent: 5468589 (1995-11-01), Urano et al.
patent: 5558971 (1996-09-01), Urano et al.
patent: 5670299 (1997-09-01), Urano et al.
patent: 5750309 (1998-05-01), Hatakeyama et al.
patent: 5876900 (1999-03-01), Watanabe et al.
patent: 6117621 (2000-09-01), Hatakeyama et al.
patent: 6159652 (2000-12-01), Sato et al.
patent: 6319815 (2001-11-01), Iguchi et al.
patent: 6444394 (2002-09-01), Sato et al.
patent: 6613836 (2003-09-01), Rumack
patent: 6656660 (2003-12-01), Urano et al.
patent: 6693049 (2004-02-01), Iguchi et al.
patent: 6716573 (2004-04-01), Fujie et al.
patent: 6743562 (2004-06-01), Momota et al.
patent: 05-249682 (1993-09-01), None
patent: 8015864 (1996-01-01), None
patent: 08-123032 (1996-05-01), None
patent: 8262721 (1996-10-01), None
patent: 09-90639 (1997-04-01), None
patent: 09-160246 (1997-06-01), None
patent: 09-211868 (1997-08-01), None
patent: 09-311452 (1997-12-01), None
patent: 10-326017 (1998-12-01), None
patent: 11095434 (1999-04-01), None
patent: 2000-267283 (2000-09-01), None
patent: 2001-085518 (2001-03-01), None
patent: 2001-102449 (2001-04-01), None
patent: 2001-168188 (2001-06-01), None
patent: 2001-176842 (2001-06-01), None
K.K. Realize, “Developments in Cu Wiring Technology”,Outline of the Total Process; Present State and Problems of Dual-damascene Cu Wiring, pp. 202-205 (1998).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Positive resist composition of chemical amplification type,... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Positive resist composition of chemical amplification type,..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Positive resist composition of chemical amplification type,... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3409775

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.