Positive resist composition for thin-film implantation...

Radiation imagery chemistry: process – composition – or product th – Diazo reproduction – process – composition – or product – Composition or product which contains radiation sensitive...

Reexamination Certificate

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Details

C430S192000, C430S193000, C430S270100, C430S326000, C430S905000

Reexamination Certificate

active

07910281

ABSTRACT:
A positive resist composition for a thin-film implantation process of the present invention includes: a resin component (A) with an acid-dissociable dissolution inhibiting group, whose alkali solubility increases by the action of an acid; an acid generator component (B) which generates an acid by irradiation with radiation; and a compound (C) having a radiation absorbing ability, wherein said resin component (A) comprises a structural unit (a1) derived from a hydroxystyrene and a structural unit (a2) obtained by substituting the hydrogen atom in a hydroxyl group of said structural unit (a1) with an acid-dissociable dissolution inhibiting group, and said acid-dissociable dissolution inhibiting group contains an acid-dissociable dissolution inhibiting group (II) represented by the following general formula (II) as a main component.

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Office Action issued on counterpart Japanese Patent Application No. 2005-026265, dated Mar. 10, 2009.
International Search Report from PCT/JP2006/301678 mailed on May 16, 2006.
Office Action issued in counterpart Chinese Patent Application No. 200680003206.3, dated May 20, 2010.

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