Positive photosensitive resin compositions

Details Positive photosensitive resin compositions Positive photosensitive resin compositions

2006-11-07

2006-11-07

Chu, John S. (Department: 1752)

Radiation imagery chemistry: process, composition, or product th

Imaged product

Including resin or synthetic polymer

C430S270100, C430S320000, C430S326000, C430S330000, C430S906000

Reexamination Certificate

active

07132205

ABSTRACT:
An end-capped polybenzoxazole precursor having acid labile functional groups, positive working photosensitive compositions thereof and use of the compositions for producing heat resistant relief images on substrates.

REFERENCES:
patent: 6143467 (2000-11-01), Hsu et al.
patent: 6232032 (2001-05-01), Nunomura et al.
patent: 6436593 (2002-08-01), Minegishi et al.
patent: 2003/0087190 (2003-05-01), Sezi
patent: 2003/0099904 (2003-05-01), Sezi
patent: 2003/0134226 (2003-07-01), Sezi
patent: 2004/0142275 (2004-07-01), Komatsu

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