Radiation imagery chemistry: process – composition – or product th – Imaged product – Including resin or synthetic polymer
Reexamination Certificate
2005-06-21
2005-06-21
Chu, John S. (Department: 1752)
Radiation imagery chemistry: process, composition, or product th
Imaged product
Including resin or synthetic polymer
C430S165000, C430S168000, C430S191000, C430S192000, C430S193000
Reexamination Certificate
active
06908717
ABSTRACT:
The present invention provides a positve photosensitive resin composition of high sensitivity which can form a pattern of high resolution and high residual film ration and which can give a cured film superior in mechanical properties, adhesivity and water absorptivity. That is, the present invention lies in a positive photosensitve resin compostion comprising 100 parts by weight of an alkali-soluble resin, 1 to 100 parts by weight of a photosensitve diazoquinone compound (B) and a filler (C), characterized in that content F of the filler (C) represented by the following formula is 2 to 70% by weight.in-line-formulae description="In-line Formulae" end="lead"?F=filler(C)/[alkali-soluble resing+filler (C)]in-line-formulae description="In-line Formulae" end="tail"?
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International Search Report, dated Jan. 15, 2002, issued by the Japanese Patent Office, for International Application No. PCT/JP01/08858. (3 pages).
Goodner Michael D.
Hirano Takashi
Meagley Robert P.
Okaaki Shusaku
Chu John S.
Intel Corporation
Smith , Gambrell & Russell, LLP
Sumitomo Bakelite Company Limited
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