Radiation imagery chemistry: process – composition – or product th – Diazo reproduction – process – composition – or product – Composition or product which contains radiation sensitive...
Reexamination Certificate
2005-03-11
2008-10-14
Chu, John S (Department: 1795)
Radiation imagery chemistry: process, composition, or product th
Diazo reproduction, process, composition, or product
Composition or product which contains radiation sensitive...
C430S018000, C430S192000, C430S193000, C430S326000, C430S330000
Reexamination Certificate
active
07435525
ABSTRACT:
Provided is a positive photosensitive resin composition which is advantageous not only in excellent sensitivity, resolution and adhesion, but also in excellent heat resistance even when the composition is cured by a low-temperature process at equal to or lower than 280° C., as well as low water absorption and capability to give a pattern with favorable configuration. The positive photosensitive resin composition contains: (a) alkaline aqueous solution-soluble polyamide having a polyoxazole precursor structure; (b) an o-quinonediazide compound; and (c) a latent acid generator which generates acid upon heating. The composition optionally further contains (d) a compound having a phenolic hydroxyl group or (e) a solvent.
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Hattori Takashi
Matsutani Hiroshi
Murakami Yasuharu
Nakano Hajime
Ooe Masayuki
Antonelli, Terry Stout & Kraus, LLP.
Chu John S
Hitachi Chemical Dupont Microsystems Ltd.
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