Positive photosensitive resin composition, and semiconductor...

Radiation imagery chemistry: process – composition – or product th – Imaged product – Multilayer

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C430S191000, C430S192000, C430S193000, C430S311000, C430S319000, C430S325000, C430S330000

Reexamination Certificate

active

08080350

ABSTRACT:
Disclosed is a positive photosensitive resin composition containing (A) an alkali-soluble resin, (B) a diazoquinone compound, (d1) an activated silicon compound and (d2) an aluminum complex. Also disclosed is a positive photosensitive resin composition containing (A) an alkali-soluble resin, (B) a diazoquinone compound, (C) a compound having two or more oxetanyl groups in one molecule and (D) a catalyst for accelerating the ring-opening reaction of the oxetanyl groups of the compound (C).

REFERENCES:
patent: 4495042 (1985-01-01), Hayase et al.
patent: 6232032 (2001-05-01), Nunomura et al.
patent: 6929891 (2005-08-01), Rushkin et al.
patent: 6939659 (2005-09-01), Naiini et al.
patent: 7026080 (2006-04-01), Nakayama et al.
patent: 7332254 (2008-02-01), Sasaki et al.
patent: 7338737 (2008-03-01), Lee et al.
patent: 7374856 (2008-05-01), Suwa et al.
patent: 7435525 (2008-10-01), Hattori et al.
patent: 0 459 395 (1991-12-01), None
patent: 0459395 (1991-12-01), None
patent: 0 961 169 (1999-12-01), None
patent: 0961169 (1999-12-01), None
patent: 1 431 822 (2004-06-01), None
patent: 1431822 (2004-06-01), None
patent: 58-174418 (1983-10-01), None
patent: 11-54934 (1999-02-01), None
patent: 11-95423 (1999-04-01), None
patent: 2000-27266 (2000-10-01), None
patent: 2003-75997 (2003-03-01), None
patent: 2004-93816 (2004-03-01), None
patent: 2005-31642 (2005-02-01), None
patent: 2005-265866 (2005-09-01), None
patent: 2005-266189 (2005-09-01), None
patent: WO 2005109099 (2005-11-01), None
Korean Office Action dated Sep. 29, 2010 for Application No. 10-2008-7015711 (6 pages).
European Search Report in EP06832830. Prepared Feb. 25, 2011, mailed Mar. 4, 2011.
Supplementary European Search Report for Application No. EP 06 83 2830 dated Mar. 4, 2011.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Positive photosensitive resin composition, and semiconductor... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Positive photosensitive resin composition, and semiconductor..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Positive photosensitive resin composition, and semiconductor... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4316253

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.