Positive photosensitive polyimide resin composition

Details Positive photosensitive polyimide resin composition Positive photosensitive polyimide resin composition

2006-04-11

2006-04-11

Chu, John S. (Department: 1752)

Radiation imagery chemistry: process, composition, or product th

Imaged product

Including resin or synthetic polymer

C430S020000, C430S028000, C430S191000, C430S192000, C430S193000, C430S326000

Reexamination Certificate

active

07026080

ABSTRACT:
The invention provides a positive photosensitive resin composition which is free from film reduction, swelling or peeling at the time of development with an aqueous alkaline solution and which provides a dimensionally stable patterns after curing, and of which the final cured film has a low water absorption and excellent alkaline resistance. A positive photosensitive polyimide resin composition characterized by comprising an organic solvent-soluble polyimide having repeating units represented by the formula (1):(wherein m is an integer of from 3 to 10,000, R1is a tetravalent organic group, R2is a bivalent organic group, provided that from 5 to 100 mol % of R2is a bivalent organic group having fluorine), a polyamic acid and a compound capable of generating an acid by irradiation with light.

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Patent Abstracts of Japan, JP 11-084653, Mar. 26, 1999.
Patent Abstracts of Japan, JP 04-284455, Oct. 9, 1992.

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