Positive photoresist resin and chemical amplified positive photo

Details Positive photoresist resin and chemical amplified positive photo Positive photoresist resin and chemical amplified positive photo

1997-09-17

1999-03-16

Chu, John S.

Radiation imagery chemistry: process, composition, or product th

Diazo reproduction, process, composition, or product

Composition or product which contains radiation sensitive...

4302701, 430905, 522 31, 522 57, 522 59, 5253288, 5253333, 525284, 526313, G03F 7004, C08F 1602, C08F 1612

Patent

active

058828354

ABSTRACT:
A chemical amplified positive photoresist composition including a resin having the repeating unit of Formula I and a photoacid generator. The resin ranges, in polystyrene-reduced molecular weight, from about 2,000 to 1,000,000. In Formula I, k and l each represent a mole ratio satisfying the condition of k+l=l. R.sub.1 is a hydrogen atom or a methyl group. R.sub.2 and R.sub.3 are independently either a hydrogen atom, a halogen atom, an alkyl group or an alkoxy group. R.sub.4 is an acetate group, a t-butoxycarbonyl group, a benzyl group, a trialkylsilyl group or an alkyl group. The photoacid generator which generates an acid by radiation. ##STR1##

REFERENCES:
patent: 5185407 (1993-02-01), Wong
patent: 5324804 (1994-06-01), Steinmann
patent: 5403695 (1995-04-01), Hayase et al.
patent: 5679496 (1997-10-01), Ohsawa et al.
patent: 5759750 (1998-06-01), Binder et al.

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