Radiation imagery chemistry: process – composition – or product th – Diazo reproduction – process – composition – or product – Composition or product which contains radiation sensitive...
Reexamination Certificate
2005-11-15
2005-11-15
Chu, John S. (Department: 1752)
Radiation imagery chemistry: process, composition, or product th
Diazo reproduction, process, composition, or product
Composition or product which contains radiation sensitive...
C430S192000, C430S193000
Reexamination Certificate
active
06964838
ABSTRACT:
A composition includes (A) an alkali-soluble resin, (B) a quinonediazide ester of a compound represented by the following formula:and (C) a compound represented by the following formula:This composition is a positive photoresist composition that is excellent in sensitivity and definition and causes less shrink.
REFERENCES:
patent: 5290657 (1994-03-01), Uetani et al.
patent: 5407779 (1995-04-01), Uetani et al.
patent: 5652081 (1997-07-01), Tan et al.
patent: 5726217 (1998-03-01), Ichikawa et al.
patent: 5738968 (1998-04-01), Hosoda et al.
patent: 5747218 (1998-05-01), Momota et al.
patent: 5866724 (1999-02-01), Ichikawa et al.
patent: 5912102 (1999-06-01), Kawata et al.
patent: 5985507 (1999-11-01), Blakeney et al.
patent: 6379859 (2002-04-01), Suzuki et al.
patent: 3-191351 (1991-08-01), None
patent: 6-167805 (1994-06-01), None
patent: 10-232492 (1998-09-01), None
patent: 2000-338661 (2000-12-01), None
Doi Kousuke
Kurihara Masaki
Maruyama Kenji
Niikura Satoshi
Suzuki Takako
Chu John S.
Tokyo Ohka Kogyo Co. Ltd.
LandOfFree
Positive photoresist composition does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Positive photoresist composition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Positive photoresist composition will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3494050