Radiation imagery chemistry: process – composition – or product th – Diazo reproduction – process – composition – or product – Composition or product which contains radiation sensitive...
Patent
1994-03-18
1995-09-12
Bowers, Jr., Charles L.
Radiation imagery chemistry: process, composition, or product th
Diazo reproduction, process, composition, or product
Composition or product which contains radiation sensitive...
430165, 430192, 430193, 430270, 430906, G03F 7023
Patent
active
054495849
ABSTRACT:
The present invention provides a positive photo-sensitive resin composition comprising a polybenzoxazole precursor as a base resin, an organic solvent-soluble polymer or its precursor (e.g., a polyamic acid) as a component for imparting improved adhesion, flexibility or heat resistance, and a diazoquinone compound and/or a dihydropyridine compound as a photosensitive agent. This photo-sensitive resin composition can form a pattern of high resolution and further has excellent adhesion and mechanical properties. The present invention further provides three novel diazoquinone compounds as a photo-sensitive agent, which compounds give high resolution, high contrast and thick-film formability when compounded in a positive photo-sensitive resin composition. The present invention furthermore provides a new type positive photo-sensitive resin composition obtained by reacting a polybenzoxazole precursor with a diazoquinone compound as a photo-sensitive agent. This photo-sensitive resin composition has excellent alkali resistance when unexposed to a light and accordingly can give a high residual film ratio.
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Patent Abstracts of Japan vol. 8, No. 79 (P-267)(1516) 11 Apr. 1984 & JP-A-58 223 147 (Fuji Yakuhin Kogyo K.K.) 24 Dec. 1983 *abstract*.
Banba Toshio
Takeda Naoshige
Takeda Toshiro
Takeuchi Etsu
Tokoh Akira
Bowers Jr. Charles L.
Chu John S.
Sumitomo Bakelite Company Ltd.
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