Positioning wafer lenses on electronic imagers

Details Positioning wafer lenses on electronic imagers Positioning wafer lenses on electronic imagers

2008-10-29

2011-11-22

Ye, Lin (Department: 2622)

Television

Camera, system and detail

Optics

Reexamination Certificate

active

08063975

ABSTRACT:
A low cost manufacturing method (300) and assembly (100) for positioning a lens (106) relative to an electronic imager (102). A viscous adhesive (104) is applied to the lens (106) or the electronic imager (102) outside of the optical path. The lens (106) is disposed on the electronic imager (102) exclusively with the adhesive (104) disposed between them.

REFERENCES:
patent: 2004/0012698 (2004-01-01), Suda et al.
patent: 2005/0007485 (2005-01-01), Vook et al.
patent: 2006/0028573 (2006-02-01), Seo et al.
patent: 2006/0132644 (2006-06-01), Shangguan et al.
patent: 2006/0181632 (2006-08-01), Makii et al.
patent: 2008/0136955 (2008-06-01), Kathman et al.
patent: 2008/0170151 (2008-07-01), McAllister et al.
patent: 2009/0284837 (2009-11-01), Lake et al.

Affiliated with

Also associated with

Rating

Positioning wafer lenses on electronic imagers does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Positioning wafer lenses on electronic imagers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Positioning wafer lenses on electronic imagers will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4307048