Positioning device for controlling the position of a workpiece i

Metal fusion bonding – With means to juxtapose and bond plural workpieces

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228 45, 228 495, H05K 1306

Patent

active

060150793

ABSTRACT:
An extended travel wire bonding machine that includes a first positioning table movable along an X axis in a first horizontal plane, a second positioning table movable along X and Y axes in a second horizontal plane, the second positioning table being supported on the first positioning table, and a bond head supported on the second positioning table. The wire bonding machine may also include a bonding tool attached to the bond head and a carrier for supporting the leadframe strip under the bonding tool. The first positioning table is moveable for substantially the entire length of the leadframe strip to allow the bonding tool to be successively moved over each semiconductor die on the leadframe strip.

REFERENCES:
patent: 4116376 (1978-09-01), Delorme et al.
patent: 4295596 (1981-10-01), Doten et al.
patent: 4659004 (1987-04-01), Fridman
patent: 4768698 (1988-09-01), Brown et al.
patent: 4878609 (1989-11-01), Farassat
patent: 5340011 (1994-08-01), Sanchez

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