Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2007-12-27
2009-12-15
Leon, Edwin A (Department: 2833)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
Reexamination Certificate
active
07632108
ABSTRACT:
A mobile device including a first circuitry supporting substrate having an upper surface and a lower surface, a second circuitry supporting substrate having an upper surface and a lower surface, the second circuitry supporting substrate at least partially overlapping the first circuitry supporting substrate, and a metallic member extending from one of the lower surface of the first circuitry supporting substrate and the upper surface of the second circuitry supporting substrate, the metallic member contacting the other of the lower surface of the first circuitry supporting substrate and the upper surface of the second circuitry supporting substrate to define a shield region between the first circuitry supporting substrate and the second circuitry supporting substrate.
REFERENCES:
patent: 4662691 (1987-05-01), Derdzinski
patent: 6776668 (2004-08-01), Scyoc et al.
patent: 7365552 (2008-04-01), Sheeran
patent: 2006/0024985 (2006-02-01), Nagata et al.
patent: 20-0345687 (2004-03-01), None
patent: 10-2005-0022115 (2005-03-01), None
Birch & Stewart Kolasch & Birch, LLP
Leon Edwin A
LG Electronics Inc.
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