Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate
2006-10-31
2006-10-31
Clark, S. V. (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Wire contact, lead, or bond
C257S724000, C257S691000
Reexamination Certificate
active
07129588
ABSTRACT:
A portable telephone including an integrated circuit chip module with a first integrated circuit chip including a first power source pad for a first power voltage and an adjacent second power source pad for a second power voltage, the first power voltage being higher than the second power voltage, a second integrated circuit chip including a third power source pad for the first power voltage and an adjacent fourth power source pad for the second power voltage, and a wiring board including a first power source wire electrically connected to the first power source pad, a second power source wire electrically connected to the second power source pad, a third power source wire electrically connected to the third power source pad, and a fourth power source wire electrically connected to the fourth power source pad. Distance between the first and second power source wires is shorter than distance between the first or second power source wires and the third or fourth power source wires, and distance between the third and fourth power source wires is shorter than distance between the first or second power source wires and the third or fourth power source wires.
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Clark S. V.
Leydig , Voit & Mayer, Ltd.
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