Portable soldering apparatus

Metal fusion bonding – Metallic heat applicator – With means to handle flux or filler

Patent

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Details

228 41, 221266, 222363, B23K 302, B23K 306

Patent

active

042168945

ABSTRACT:
An improved soldering device has a magazine to hold preformed solder shapes for dispensing them through a tubular duct onto a channel formed in a soldering bit. The channel leads to an opening formed in the bit to permit passage therethrough of the preformed solder shapes. An actuator is affixed to the magazine to dispense the preformed solder shapes one at a time. The preformed solder shapes do not become molten until passing through the opening in the bit.

REFERENCES:
patent: 1061170 (1913-05-01), Giffen
patent: 1517952 (1924-12-01), Capparella
patent: 1691052 (1928-11-01), Fay
patent: 2447110 (1948-08-01), Bitzenburger
patent: 2562666 (1951-07-01), Gustafson et al.
patent: 2579549 (1951-12-01), Cave
patent: 3146747 (1964-09-01), Stebbing, Jr.

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