Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1993-01-08
1994-07-19
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361752, 361792, 361744, 439 44, 257686, H01R 2368
Patent
active
053315162
ABSTRACT:
The present invention makes it easier to connect board modules to each other and to increase reliability in a portable semiconductor apparatus having two board modules within a frame. Upper-row connection pins and lower-row connection pins have electrode leads, each having connection portions divided into two parts that are arranged in respective upper and lower rows. One of the board modules is inserted between one upper-row electrode lead and one lower-row electrode lead and electrically connected. The other board module is inserted between another upper-row electrode lead and another lower-row electrode lead and electrically connected. In this way, the board modules are electrically connected to each other.
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Ecker et al, "Printed Wiring Card And Board Package For Semiconductor", IBM Technical Disclosure Bulletin, vol. 24, No. 11A, Apr. 1982, pp. 5453-5455.
Kimura Masatoshi
Shinohara Takayuki
Mitsubishi Denki & Kabushiki Kaisha
Picard Leo P.
Whang Young
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