Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2005-07-26
2005-07-26
Lea-Edmonds, Lisa (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S679090, CD14S314000, CD19S045000
Reexamination Certificate
active
06922335
ABSTRACT:
A back enclosure has a stepped portion disposed perpendicularly to one side of a rectangular flat portion. The stepped portion is extended from the one side to a side opposite to it and virtually parallel to a flow of a molten material. With the described configurations, the enclosure can be reduced in thickness without lowering its strength and, in addition, can be manufactured without impairing moldability of the molten metal in the course of the manufacture of it by metal molding. Thus with such a back enclosure, a portable information processor being lighter and yet having a higher withstanding strength against external forces can be provided.
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patent: 09-062400 (1997-03-01), None
Iwamoto Akira
Shimada Isao
Lea-Edmonds Lisa
Matsushita Electric - Industrial Co., Ltd.
RatnerPrestia
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