Portable electric hot air rework tool for soldering and desolder

Electric heating – Heating devices – Combined with container – enclosure – or support for material...

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34202, 34239, 34243R, 156497, 165 85, 219230, 219367, 219368, 219379, 219380, 228 20, 228180A, 228242, 228264, B23K 304, H05B 300, H05K 334, F24H 304

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active

044265719

ABSTRACT:
A portable electric hot air rework tool for directing a stream of turbulent hot air through removable and replaceable nozzles with a selectably sized orifice to predetermined size localized areas of a printed circuit assembly until a temperature sufficient to melt solder is achieved, thereby facilitating the soldering/desoldering of circuit components or parts of components mounted thereon. The apparatus essentially comprises a portable work station having upper and lower heat tubes, or plenums, through which a blower-forced stream of air made turbulent by turbulators with contra-pitched blades is directed, an adjustable support grid for supporting the pc assembly, within the directed air stream and a three-position switch for controlling the temperature and flow of the air in the heat tubes. An alignment positional indicator aids in precise location of the printed circuit assembly. The heat tubes are lined with refractory cement for electrical and thermal insulation, while the turbulators, heat tubes, and blower are electrically conductive and connnected metal for the removal of static electricity from the air stream. A heat sensitive lacquer is used to detect when the solder holding the component to the pc assembly has achieved a desired temperature and at which temperature the component can be removed or replaced. The heat tubes are provided with electric resistance heaters for heating the air stream directed through the nozzle and are lined with a refractory ceramic cement. The support grid is of sufficiently large grid size as to remain cool during operation with the assembly supported thereon.

REFERENCES:
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patent: 4187973 (1980-02-01), Fortune
patent: 4205221 (1980-05-01), Meyer
patent: 4295596 (1981-10-01), Dotem et al.
"Nozzle for Reflow Soldering", F. Kristiansen; IBM Technical Disclosure Bulletin; vol. 11, No. 5; Oct. 1968, p. 482.
"Solder Reflow Tool", C. Trollman; IBM Technical Disclosure Bulletin, vol. 11, No. 10, Mar. 1969, p. 1298.
"Use of a Heated Gas Jet to Remove a Silicon Chip Soldered to a Substrate", K. S. Sacher et al., IBM Technical Disclosure Bulletin, vol. 20, No. 9, Feb. 1978, pp. 3725, 3726.
"Cleaning of Solder Pads Prior to a Rework Operation" K. Schink et al., IBM Technical Disclosure Bulletin, vol. 18, No. 5, Oct. 1975, pp. 1384, 1385.

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