Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond
Patent
1993-05-06
1994-09-13
Ryan, Patrick J.
Stock material or miscellaneous articles
Structurally defined web or sheet
Discontinuous or differential coating, impregnation or bond
428901, 4283213, 4283044, 361749, B32B 900
Patent
active
053467507
ABSTRACT:
A method of manufacturing an organic substrate used for printed circuits, which includes the steps of forming through-holes (3) in a porous raw material (2) provided with cover films (1) and having compressive shrinkage, filling electro-conductive paste (4) into the through-holes (3), separating the cover films (1) from the porous raw material (2) filled with the electro-conductive paste (4) in its through-holes (3), applying metal foils (5) onto the surfaces of the porous raw material (2) from which the cover films (1) have been separated, and compressing the porous raw material (2) applied with the metal foils (5) through heating and pressurization, whereby the electro-conductive substances in the electro-conductive paste are connected for electrical connection between the metal foils.
REFERENCES:
patent: 4383363 (1983-05-01), Hayakawa et al.
patent: 4857381 (1989-08-01), Suzuki
patent: 4895756 (1990-01-01), Suzuki
patent: 5035939 (1991-07-01), Conlon
patent: 5047283 (1991-09-01), Leatherman et al.
patent: 5049435 (1991-09-01), Uno et al.
patent: 5117069 (1992-05-01), Higgins, III
Patent Abstracts of Japan; vol. 013, No. 230(E-764) May 26, 1989; & JPA-1-01 037 079 (Shin Kobe Electric Mach Co) Feb. 7, 1989; abstract.
Patent Abstracts of Japan; vol. 015, No. 179 (E-1064) May 8, 1991; & JPA-03 041 794 (Casio Comput Co) Feb. 22, 1991; abstract.
Fukumura Yasushi
Hatakeyama Akihito
Horio Yasuhiko
Kojima Tamao
Sogo Hiroshi
Jewik Patrick R.
Matsushita Electric - Industrial Co., Ltd.
Ryan Patrick J.
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