Abrading – Abrading process – Combined abrading
Reexamination Certificate
2005-05-31
2005-05-31
Nguyen, George (Department: 3723)
Abrading
Abrading process
Combined abrading
C451S041000, C451S921000, C451S058000
Reexamination Certificate
active
06899602
ABSTRACT:
A porous polishing pad is useful for polishing semiconductor substrates. The porous polishing pad has a porous matrix formed from a coagulated polyurethane and a non-fibrous polishing layer. The non-fibrous polishing layer has a polishing surface with a pore count of at least 500 pores per mm2that decreases with removal of the polishing layer; and the polishing surface has a surface roughness Ra between 0.01 and 3 μm.
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Rodel® Finishing Pads; Rodel® Brochure, Rev. 3.0; Feb. 1, 2002, Rodel, Inc., Newark, DE.
Crkvenac T. Todd
Fawcett Clyde A.
Foster Bernard
Prygon Kenneth A.
Biederman Blake T.
Nguyen George
Rohm and Haas Electronic Materials CMP Holdings, NC
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