Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1997-11-17
2000-01-25
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361702, 361707, 361712, 165 803, 174 163, 257706, H05K 720
Patent
active
060184590
ABSTRACT:
A heat sink is disclosed having an elongate, porous metal structure, including multiple sets of thermally conductive members. The members, which are interwoven, direct heat away from a heat producing component. The elongate structure of the matrix structure can be formed in a variety of predetermined forms, including a coiled structure or an elliptically coiled structure. Alternatively, the matrix structure is plated for added thermal conductivity between the sets of members. In addition, air flow is directed over the heat sink for added convection of heat. The heat sink is fabricated using a mesh of thermally conductive material such as copper or aluminum and can be provided with a plurality of protuberances. The heat sink is thermally bonded to the heat producing component. Alternatively, the heat sink has a ledge for sealing with a duct.
A method for cooling a heat producing component is also disclosed. The method includes the steps of providing a heat sink structure as above, thermally coupling the heat sink structure to a heat producing component, and directing a fluid flow over the heat sink structure.
REFERENCES:
patent: 3479731 (1969-11-01), Mantel et al.
patent: 3928907 (1975-12-01), Chisholm
patent: 4843693 (1989-07-01), Chisholm
patent: 5312508 (1994-05-01), Chisholm
patent: 5358032 (1994-10-01), Arai et al.
patent: 5727622 (1998-03-01), Gurevich et al.
"Serpentine Copper Mesh Forms Heat Sinks", Electronic Packaging and Production, Ed. Howard Markstein, 42, (Oct. 1990).
Carlson Douglas M.
Malosh Edward A.
Cray Research Inc.
Datskovsky Michael
Picard Leo P.
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