Porous insulating film and its laminates

Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Composite having voids in a component

Reexamination Certificate

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C428S315500, C428S901000, C428S473500

Reexamination Certificate

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10785413

ABSTRACT:
A porous insulating film comprising a highly heat resistant resin film having a fine porous structure with a mean pore size of 0.01-5 μm in at least the center of the film, and a porosity of 15-80%. A laminate is prepared by forming a heat resistant adhesive layer or a conductive metal layer or an inorganic or metal substrate on one or both sides of the porous insulating film or by forming an inorganic or metal substrate on one side of the porous insulating film and a conductive metal layer on the other side.

REFERENCES:
patent: 4450198 (1984-05-01), Michaels
patent: 4474662 (1984-10-01), Makino et al.
patent: 4613544 (1986-09-01), Burleigh
patent: 4824743 (1989-04-01), Fujii et al.
patent: 5510395 (1996-04-01), Tomioka et al.
patent: 5547833 (1996-08-01), Dorval et al.
patent: 6090081 (2000-07-01), Sudo et al.
patent: 6115514 (2000-09-01), Ando et al.
patent: 6187248 (2001-02-01), O'Neill et al.
patent: 2101137 (1992-04-01), None
patent: 2-2856 (1990-01-01), None
patent: 3-166930 (1991-07-01), None
patent: 9-100363 (1997-04-01), None
Complete Translation of JP 02-2856, “Porous Membrane”, Ito et al, Jan. 8, 1990, 16 pages.
Saunders et al, the article “Microporous Polyimide Films for Reduced Dielectric Applications”, SAND94-2831, Aug. 1996, 13 pages.
Patent Abstract of Japanese Application No. 01305812.
Patent Abstract of Japanese Application No. 07259039.

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