Porous encapsulating composition for electrical apparatus

Details Porous encapsulating composition for electrical apparatus Porous encapsulating composition for electrical apparatus

1980-05-13

1982-10-26

Silverman, Stanley S.

Stock material or miscellaneous articles

Coated or structually defined flake, particle, cell, strand,...

Particulate matter

428407, B32B 516

Patent

active

043562370

ABSTRACT:
A porous encapsulating composition is formed of particulate filler material which is cohesively bonded together by a binder material which forms beads around the points of contact between contiguous particles. In one embodiment, the filler material includes round gravel and resin-coated sand particles with the resin being redistributed to form beads around the points of contact between contiguous particles.

REFERENCES:
patent: 1947085 (1934-02-01), Hill et al.
patent: 2155016 (1939-04-01), Kershaw
patent: 2810989 (1957-10-01), Terry
patent: 2896278 (1959-07-01), Wasserback
patent: 2941905 (1960-06-01), Hofmann
patent: 2991267 (1961-07-01), Bean
patent: 3022187 (1962-02-01), Eyraud et al.
patent: 3161843 (1964-12-01), Hodges et al.
patent: 3166615 (1965-01-01), Farrell
patent: 3354247 (1967-11-01), Zehender et al.
patent: 3598241 (1971-08-01), Vondracek et al.
patent: 3610418 (1971-10-01), Caldenrood
patent: 3657402 (1972-04-01), Stana et al.
patent: 3773187 (1973-11-01), Caldenrood et al.
patent: 3914358 (1975-10-01), Dixon et al.
patent: 4082916 (1978-04-01), Jacklic et al.
patent: 4254019 (1981-03-01), Kroyer

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