Powder metallurgy processes – Powder metallurgy processes with heating or sintering – Making porous product
Patent
1993-04-06
1995-08-22
Prebilic, Paul B.
Powder metallurgy processes
Powder metallurgy processes with heating or sintering
Making porous product
623 23, 623901, 623 16, A61F 228
Patent
active
054435102
ABSTRACT:
The method forms a thin layer of metal mesh on the surface of the implant for the bonding with a porous surface layer to prevent the formation of notches within the body of the implant. The layer of metal mesh can be formed by a number of known methods including conventional welding processes such as arc welding, resistance welding, electron beam welding, laser beam welding, friction welding, ultrasonic welding, cladding. The porous metal surface layer is preferably formed from titanium wire or titanium beads in a known process. The porous surface layer is bonded by a known process such as diffusion bonding, sintering, welding, or cladding.
By bonding the porous surface layer to the thin layer of metal mesh, notches normally formed in the body of the implant are substantially eliminated. Therefore, the designer of the implant is not limited as to the location and amount of porous surface layer to be placed on the implants.
REFERENCES:
patent: 4636219 (1987-01-01), Pratt et al.
patent: 4943412 (1990-07-01), Bania et al.
patent: 4969904 (1990-11-01), Koch et al.
patent: 4976738 (1990-12-01), Frey et al.
patent: 4980127 (1990-12-01), Parris et al.
patent: 5198308 (1993-03-01), Shetty et al.
Panchison Clarence M.
Shetty H. Ravindranath
Dawson Todd A.
Prebilic Paul B.
Zimmer Inc.
LandOfFree
Porous coated implant and method of making same does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Porous coated implant and method of making same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Porous coated implant and method of making same will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2138128