Pop semiconductor device manufacturing method

Details Pop semiconductor device manufacturing method Pop semiconductor device manufacturing method

2009-09-24

2011-11-01

Lee, Edmund H. (Department: 1744)

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

To produce composite, plural part or multilayered article

C264S275000, C264S328700

Reexamination Certificate

active

08048358

ABSTRACT:
The objective of the invention is to prevent electrostatic destruction of semiconductor chips during resin molding. With the semiconductor device manufacturing method, a substrate400that includes on the surface multiple semiconductor chips410and liquid resin434supplied to multiple semiconductor devices is supported by an electrically insulated lower die200. An upper die110in which multiple shape-forming parts (cavities)112are formed is pressed against lower die200through the medium of a polymer release film300, and liquid resin434on the substrate is molded.

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patent: 6344162 (2002-02-01), Miyajima
patent: 6743389 (2004-06-01), Miyajima et al.
patent: 7147447 (2006-12-01), Takahashi
patent: 7520052 (2009-04-01), Takahashi et al.
patent: 7651887 (2010-01-01), Morita et al.
patent: 59096739 (1984-06-01), None

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