Polytetrafluoroethylene thin film chip carrier

Details Polytetrafluoroethylene thin film chip carrier Polytetrafluoroethylene thin film chip carrier

1999-10-04

2001-07-10

Paladini, Albert W. (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S255000, C174S202000, C029S852000, C257S668000

Reexamination Certificate

active

06259037

ABSTRACT:

BACKGROUND OF THE INVENTION
In the field of chip carriers, it is desirable to have carriers with fine line circuitry, that is, circuitry having 2.0 mil wide lines or narrower, with less than a 2.5 mil space between lines. Fine line circuitry permits high wireability which reduces the need for extra layers within the carrier, and supports dense chip arrays. Such fine line resolution has been achievable in ceramic carriers; however, such resolution has not been obtainable with conventional organic carriers.
It would be desirable to have an organic carrier with fast signal speed, low dielectric constant and fine line circuitry.
SUMMARY OF THE INVENTION
The present invention provides an organic chip carrier particularly useful with flip chips, comprising an organic dielectric layer, a first layer of circuitry disposed on the dielectric layer, an organic conformational coating disposed over the first layer of dielectric and the first layer of circuitry, and a layer of fine line circuitry having line width of about 2.0 mil or less, preferably about 1.0 mil or less, preferably about 0.7 mil, and a space between lines of about 1.5 mil or less, preferably about 1.1 mil, disposed on the conformational layer. Preferably the dielectric layer is free of woven fiber glass. The conformational coating preferably has a dielectric constant of about 1.5 to about 3.5, and a percent planarization of greater than about 30%. The invention also relates to methods of making the dielectric coated chip carrier.


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